CORVALLIS, USA: Deep Photonics Corp., the ultra fast fiber laser company for the semiconductor, electronics and photovoltaic marketplace, has introduced two new fiber laser platforms -– the FLP-532-PPP and the FLP-355-PPP –- designed for the photovoltaic industry.
The new laser platforms feature adjustable pulse width, pulse burst packets, and variable pulse packet frequency. The new lasers allow for film side scribing of CIGS, a-Si and CdTe and through puts unachievable using nanosecond lasers. The lasers are currently available and have been shipped to OEM’s for integration with scribing tools for release this summer.
The FLP-532-PPP and the FLP-355-PPP are visible and ultra violet lasers combining high-power output with extended lifetime, output stability, and reliability needed for demanding laser applications. With the introduction of Deep Photonics’ new Picosecond Packet Pulsing (P³) technology, the lasers provide significant improvement in cold ablation of materials.
P³ technology delivers extremely accurate depth control with pulse packet energy effective for the thin film materials currently being utilized by the solar industry.
The proprietary pulsing technology provides an optimum combination of precise, efficient material ablation while virtually eliminating the destructive affects due to thermal heating of adjacent material. Both laser platforms combine benchmark performance with design innovations to deliver consistent performance at a low operating cost.
“PV manufacturers and equipment OEMs have specifically requested an ultra-fast, short-pulse laser that cleanly and accurately ablates current and future material sets at higher throughput than today’s current technology,” said Joe LaChapelle, CEO of Deep Photonics.
“The FLP-532-PPP and FLP-355-PPP lasers directly address this need. They deliver break-through performance, multiple wavelength output, pulse-to-pulse stability and high average power. Film side processing reduces the cost of the glass used and the cost associated with glass defects that contribute to module defects and panel lifetime issues.”
The output characteristics of the lasers make them ideal for applications including edge isolation, laser fired contacts, via thru contacts, front surface contacts and thin film patterning.
“With the 532 and 355 platforms we are bringing cold ablation processing to photovoltaic applications,” commented Dr. Mike Munroe, Director of Technology for Deep Photonics.
“The combination of ionizing photonic energy, picosecond pulse packets, and adjustable repetition rates makes the lasers ideal for solar cell manufacturing applications. Due to their wavelength and high peak power, picosecond fiber lasers can remove sub-micron layers with fast plume evaporation and without excessive heat transfer to a substrate.
"The laser’s high repetition rates of energetic laser pulses require lower laser fluence than what is necessary for nanosecond lasers. As a result, our innovative fiber laser diminishes the heating, melting, and recasting associated with longer wavelengths and longer nanosecond pulses.
"Machined features are sharper and can be made smaller. The result is reduction in P1 shorts, decrease in P2 TCO series resistance and a decrease in shunt conductance offering PV Thin Film manufactures improved overall panel efficiency.”
The new 532 nm and 355 nm Deep Fiber Lasers operate at up to 10 watts and 5 watt respectively allowing the operator to define energy delivery strategies that feature 10-50 ps pulses grouped in packets from 10 ns up to 10 µs, variable pulse packet frequencies 500 kHz to 50 MHz, making the laser ideal for processing crystalline silicon (c-Si) and new advanced thin films (CdTe & CuInSe2).
Showing posts with label Deep Photonics. Show all posts
Showing posts with label Deep Photonics. Show all posts
Wednesday, July 15, 2009
Deep Photonics opens materials processing lab for picosecond laser processing
CORVALLIS, USA: Deep Photonics, the ultra fast fiber laser company for the semiconductor, electronics and photovoltaic marketplace, announced the opening of a new materials processing applications lab at its corporate headquarters in Corvallis, Oregon.
The 1,500 sq. ft. clean room enables Deep Photonics to work closely with OEMs and manufacturers to test material samples and develop processes with Deep’s picosecond fiber lasers.
The lab will demonstrate how ultra fast fiber lasers are a unique and superior processing solution for a wide range of materials, including historically difficult-to-process materials for conventional nanosecond lasers, such as thin films, glasses, dielectrics and metals.
The facility includes state-of-the-art automation and analysis tools for inspection/measurement of processed materials including a linear stage in the clean room provided by Primatics Corporation of Tangent, Oregon.
This high-accuracy, high-throughput stage allows Deep Photonics to develop film side scribing for a-Si solar thin films at over 2 meters per second and deliver that process to OEM’s building systems for the thin film scribing for the solar industry.
Customers can access FIB (Focused Ion Beam) images, a profile meter and a variety of optical and electrical measurements of their samples the same day greatly reducing the cycle time for process development.
In the lab, customers also have access to Deep Photonics lasers including the FLP-1064-PPP, FLP-532-PPP and the FLP-355-PPP infrared, visible and ultra violet fiber laser which combines high output power with outstanding stability and reliability needed for demanding laser applications. The lasers feature Picosecond Packet Pulsing (P³) technology, providing a significant innovation in cold ablation of materials.
P³ technology delivers extremely accurate depth control with pulse packet energy effective for a variety of materials currently being utilized by the semiconductor, electronics and solar industry. This proprietary pulsing technology provides an optimum combination of precise, efficient material ablation while virtually eliminating the destructive effects due to thermal heating of adjacent material.
The lab is well equipped with optics, stages, microscopes and the other tools required to do process development. It is staffed by process engineers and laser scientists with years of experience in laser materials interaction.
“Deep Photonics’ new laser technology provides advanced, compact, efficient and long life lasers and an alternative to nanosecond laser technology,” said Joe Lachapelle, founder and CEO of Deep Photonics.
“Our new applications lab brings together our advanced laser technology with the expertise of our industrial customers to process materials more effectively using picosecond fiber laser products. While we are targeting the many known applications for lasers, like dicing, drilling and scribing, we are also learning the potential of ultra fast lasers for many industrial markets. With the opening of our new facility, customers have a means to test and deliver these new applications to the market.”
The 1,500 sq. ft. clean room enables Deep Photonics to work closely with OEMs and manufacturers to test material samples and develop processes with Deep’s picosecond fiber lasers.
The lab will demonstrate how ultra fast fiber lasers are a unique and superior processing solution for a wide range of materials, including historically difficult-to-process materials for conventional nanosecond lasers, such as thin films, glasses, dielectrics and metals.
The facility includes state-of-the-art automation and analysis tools for inspection/measurement of processed materials including a linear stage in the clean room provided by Primatics Corporation of Tangent, Oregon.
This high-accuracy, high-throughput stage allows Deep Photonics to develop film side scribing for a-Si solar thin films at over 2 meters per second and deliver that process to OEM’s building systems for the thin film scribing for the solar industry.
Customers can access FIB (Focused Ion Beam) images, a profile meter and a variety of optical and electrical measurements of their samples the same day greatly reducing the cycle time for process development.
In the lab, customers also have access to Deep Photonics lasers including the FLP-1064-PPP, FLP-532-PPP and the FLP-355-PPP infrared, visible and ultra violet fiber laser which combines high output power with outstanding stability and reliability needed for demanding laser applications. The lasers feature Picosecond Packet Pulsing (P³) technology, providing a significant innovation in cold ablation of materials.
P³ technology delivers extremely accurate depth control with pulse packet energy effective for a variety of materials currently being utilized by the semiconductor, electronics and solar industry. This proprietary pulsing technology provides an optimum combination of precise, efficient material ablation while virtually eliminating the destructive effects due to thermal heating of adjacent material.
The lab is well equipped with optics, stages, microscopes and the other tools required to do process development. It is staffed by process engineers and laser scientists with years of experience in laser materials interaction.
“Deep Photonics’ new laser technology provides advanced, compact, efficient and long life lasers and an alternative to nanosecond laser technology,” said Joe Lachapelle, founder and CEO of Deep Photonics.
“Our new applications lab brings together our advanced laser technology with the expertise of our industrial customers to process materials more effectively using picosecond fiber laser products. While we are targeting the many known applications for lasers, like dicing, drilling and scribing, we are also learning the potential of ultra fast lasers for many industrial markets. With the opening of our new facility, customers have a means to test and deliver these new applications to the market.”
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