SAN JOSE, USA: Silicon Genesis, a leader in process and technology for engineered substrates announced that it has continued to make progress with its high volume manufacturing PolyMax system.
SiGen has now produced 156 mm square kerf-free monocrystalline silicon wafers in thicknesses ranging from 80um to 125um. Kerf is the material converted into saw dust, inherent in all sawing processes. This achievement delivers the first true mono c-Si kerf-free wafering for the PV industry.
The introduction of the PolyMax high volume manufacturing system brings the industry one step closer to replacing wire saw processes with a lower cost waste-free wafering solution. A unique feature of the PolyMax technology is its ability to produce wafers thinner than is achievable with wire saw technology, allowing the industry to produce cells with higher conversion efficiencies and lower cost.
“We believe the cost benefit of using SiGen’s kerf-free wafers will allow the PV industry to profitably reach unsubsidized grid parity. The increasing availability of this highly efficient wafering technology is key towards achieving this goal,” said Francois Henley, CEO of SiGen.
At the 26th European Photovoltaic Solar Energy Conference and Exhibition, Francois Henley will highlight and compare its kerf free technology in a presentation titled “Kerf-free Wafering for High-Volume, High-Efficiency c-Si Cell Production” (2BO.7.5). In addition, the company will detail the economic benefits of the technology in a visual presentation on “Mono and Multi Crystalline Silicon – Supply Chain Analysis and BOS Impact” (2CV.2.45).