Friday, June 17, 2011

Henkel demos comprehensive product line for front- and back-end PV assembly

ROCKY HILL, USA: At Semicon West and Intersolar North America, July 12 through 14, at the Moscone Center in San Francisco, Henkel Corp. will demonstrate its broad capabilities for photovoltaic manufacturing to exhibitors interested in both front- and back-end production processes.

Henkel's two booths, #5965 at Semicon West and #5329 at Intersolar North America, will exhibit the latest adhesive, sealant, and cleaner technologies for photovoltaic manufacturing and installation.

The Henkel booths will present the company's full line of adhesive and sealant products for front- and back-end solar applications from silicon wafer production to module assembly to mounting. Henkel offers products for all solar design sub-segment architectures including traditional crystalline modules, thin film, flexible BIPV, concentrators, and reflective CSPs.

At the Semicon West booth, Henkel will focus on products for front-end processes that create the electrically conductive layer of the photovoltaic module: wafer production, stringing operations, and electrical systems. At the Intersolar North America booth, the company will focus on back-end processes designed to make the module durable, reliable and water/weathertight.

Henkel products include structural adhesives, elastomers, thermally and electrically conductive materials, die attach adhesives, potting compounds, sealants, printable inks, molding compounds, maskings, solders, and cleaners. These products are specifically designed for applications including ingot bonding, wafer cleaning, solar cell bonding, housing assembly, glass/PMMA lens bonding/sealing, junction box potting/fixturing/bonding/sealing, module framing/mounting, electrically conductive bonding, frameless sealing/module mounting, laminating to plastic or metal panels, laminating to flexible roofing membranes, and weather/UV protection.

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